SUMMARY
Partow’s technology is based on crystal ion slicing of lithium niobate wafers. The process uses ion implantation to weaken the crystal bondage in a lithium niobate wafer.
FEATURES
- Orientation:
- X-cut
- Primary Flat:
- '+Z
- Secondary Flat:
- '-Y
- LN Film Diameter:
- 100mm
- Thickness:
- 600nm
