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Wafer Bonding Equipment

CATEGORY

SUPPLIER

Partow Technologies

FEATURES

材料:: シリコン/LN/石英/GaAs/InP

直径:: 25mm/100mm

厚さ:: 100um-1mm

表面粗さ:: <0.5mm

Material:: Silicon/LN/Quartz/GaAs/InP

Diameter:: 25mm/100mm

Thickness:: 100um-1mm

Surface Roughness:: <0.5mm

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