Air Cooled OSFP Thermal Solution Module
空冷OSFP熱ソリューションモジュール
- メーカ
製品概要
Cofan’s air-cooled OSFP thermal modules are engineered to meet the growing thermal demands of next-generation AI servers and high-speed telecommunications infrastructure. Designed specifically for OSFP (Octal Small Form-Factor Pluggable) applications, these modules leverage advanced aluminum heat sink technologies—including extruded, skived fin, and zipper fin designs—optimized for forced-air environments.
