Electronic Device/Semiconductor Material | アイウェーヴ株式会社 - パート 29

Electronic Device/Semiconductor Material

Electronic Device（138）

Heat-Dissipation Device（16）

Semiconductor Material（19）

Electronic Device（138）

SAR Rx Signal Processing ASIC

SAR Rx Signal Processing ASIC

Rad-Hard 3-Channel104dB SINAD 3.2kSps Sigma-Delta ADC

Rad-Hard 3-Channel104dB SINAD 3.2kSps Sigma-Delta ADC

ASIC Based Correlation Radiometer

ASIC Based Correlation Radiometer

X- & Gamma-Ray Energy/Timing Measurement

X- & Gamma-Ray Energy/Timing Measurement

Polarimeter Spectrometer ASIC

Polarimeter Spectrometer ASIC

ASIC Evaluation Board

ASIC Evaluation Board

Spectrometer ASIC(3rd gen)

Spectrometer ASIC(3rd gen)

Spectrometer ASIC(2nd gen)

Spectrometer ASIC(2nd gen)

Heat-Dissipation Device（16）

Friction Stir Welding

Friction Stir Welding

Extrusioin

Extrusioin

CNC Machining

BGA Heatsink

BGA Heatsink

Stacked Fin/Zipper Fin Heatsink

Stacked Fin/Zipper Fin Heatsink

Skived Fin Heatsink

Skived Fin Heatsink

Extruded Heatsink

Extruded Heatsink

Crimped Heatsink

Crimped Heatsink

Semiconductor Material（19）

Ensemble NV Center

Ensemble NV Center

Pure Diamond Layer

Pure Diamond Layer

MOCVD Service

MOCVD Service

MBE Service

MBE Service

Copper-Free Silicon Wafer

Copper-Free Silicon Wafer

CO-TAIC

CO-TBGU

CO-TMGU

〈back to the Category list